Micro-Tuflok Pull-out testing - before and after wave soldering

MICRO-TUFLOK PULL-OUT TESTING
BEFORE/AFTER WAVE SOLDERING

Testing Procedure:
Performed on a Tinius Olsen 5000 Tensile Tester with a 5000 lb. transducer. The component leads are cut so that they will not be a factor. A two inch machinist clamp is attached to the component directly above the Micro-Tuflok. The PC Board is then placed on a block while the clamp slides onto a hook on the Tinius Olsen. The PC Board is secured to the block. Tension force is then applied at a rate of 1.50 inch/minute. The peak force and the conditions at which the peak force was encountered are recorded. The data listed below determines that the pull-out force of the Micro-Tuflok is approximately 50 to 60 lbs. and does not degrade after exposure to the wave soldering process.

Micro-Tufloks not wave soldered.

Board 1	53 lbs.	Component Broke
Board 2	54 lbs.	Clamp released board re-tested
	56 lbs.	Micro-Tuflok pulled out

Micro-Tufloks wave soldered twice.

Board 1	60 lbs.	Micro-Tuflok pulled-out
Board 2	50 lbs.	Clamp released
Board 3	45 lbs.	Part bent up then clamp released
Board 4	43 lbs.	Clamp released part re-tested
	44 lbs.	Component broke
Board 5	46 lbs.	Clamp released part re-tested
	49 lbs.	Micro-Tuflok pulled-out
Board 7	60 lbs.	Micro-Tuflok pulled-out

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Appendix

MICRO-TUFLOK PULL-OUT TESTING
BEFORE/AFTER WAVE SOLDERING

Appendix

Appendix

MICRO-TUFLOK PULL-OUT TESTINGBEFORE/AFTER WAVE SOLDERING

Appendix

MICRO-TUFLOK PULL-OUT TESTING
BEFORE/AFTER WAVE SOLDERING